J-STD-003C WAM1: Solderability Tests for Printed Boards
4 Products
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards