IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing
IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations
IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...
IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards
IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-7092: Design and Assembly Process Implementation for Embedded Components
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards