J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
56 Products
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IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards
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IPC-9204: 印刷电子柔性与可拉伸性能测试指南
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IPC-A-640: 光纤，光缆和混合线束组件的验收要求
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IPC/WHMA-A-620C: Kábel- és huzalköteg-szerelvények követelményei és elfogadása
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IPC-J-STD-001G: ข้อกำหนดสำหรับการบัดกรีอิเล็กทรอนิกส์และงานประกอบอิเล็กทรอนิกส์
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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása
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IPC-A-610G: การยอมรับของงานประกอบอิเล็กทรอนิกส์
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IPC-4591A: 印刷电子功能导电材料要求
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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC-4101E: 刚性及多层印制板用基材规范
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IPC-6013D: 挠性和刚挠印制板的鉴定及性能规范
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IPC-A-610G: Elektronikai szerelvények elfogadhatósága
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IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求 - Chinese
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IPC-7801: 再流焊炉工艺控制标准 - Chinese
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IPC-A-610G: 电⼦组件的可接受性 -Chinese
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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
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IPC/WHMA-A-620C: 线缆及线束组件的要求与验收 - Chinese
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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards
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IPC-7091: Design and Assembly Process Implementation of 3D Components
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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
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IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards