132 Products

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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

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IPC-A-640: 光纤,光缆和混合线束组件的验收要求

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-A-620B-S-CN: IPC/WHMA-A-620B航天应用电子部件补充标准

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-1401-CN: 供应链社会责任管理体系指南

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IPC-4101E: 刚性及多层印制板用基材规范

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-1401: Supply Chain Social Responsibility Management System Guidance

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-9204: 印刷电子柔性与可拉伸性能测试指南

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IPC-A-620C-NL: Eisen en acceptatie van kabel en draadboom assemblage

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IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics

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IPC-7711/21C: 전자 어셈블리들의 리웤, 변경 및 수리

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...

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IPC/WHMA-A-620C: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC/WHMA-A-620C: 線纜及線束組件的要求與驗收

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IPC-7711/21C: Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespołów Elektronicznych

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1