IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
IPC-A-610G: Acceptability of Electronic Assemblies
J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-A-610G: Tiêu Chuẩn Chấp Nhận Các Sản Phẩm Lắp Ráp Điện Tử
IPC-A-610G: Godkendelseskrav for elektronikprodukter
IPC-J-STD-001G: Krav til loddede elektriske og elektroniske produkter
IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards
IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
IPC-J-STD-003C-WAM1&2-English: Solderability Tests for Printed Boards
IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7091: Design and Assembly Process Implementation of 3D Components
IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard
IPC-1401: Supply Chain Social Responsibility Management System Guidance
IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics
IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies
J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...
IPC/WHMA-A-620C: Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC/WHMA-A-620C: Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây và Bộ Cáp...