95 Products

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Nonmember: $168.00

IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-2291: Design Guideline for Printed Electronics

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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J-STD-005A: Requirements for Soldering Pastes

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-1401: Supply Chain Social Responsibility Management System Guidance

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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...

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IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring

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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...