IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
IPC-D-422: Design Guide for Press Fit Rigid Printed Board Back Planes
IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components