IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum
10 Products
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Member: $47.00 Nonmember: $93.00
JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
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IPC-HM-860: Specification for Multilayer Hybrid Circuits
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IPC-HDBK-005: Guide to Solder Paste Assessment
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IPC-D-354: Library Format Description for Printed Boards in Digital Form
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IPC-D-422: Design Guide for Press Fit Rigid Printed Board Back Planes
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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
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IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
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IPC-4761: Design Guide for Protection of Printed Board Via Structures