IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC/WHMA-A-620 Test Data Tables

IPC/WHMA-A-620B-Redline

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

IPC/JEDEC J-STD-609A Errata Information

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-7527: 焊膏印刷要求 - Chinese

IPC-2220-FAM: Design Standards for Printed Boards

IPC-7095C-CN: BGA设计与组装工艺的实施

A-620B-EE: Juhtme- ja kaablikoostude vastavusnõuded

A-620B-TR: Kablo ve Kablo Takımları için Kabul Gereklilikleri

A-620B-IL: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620B-KR: 케이블과 와이어 하네스 어셈블리들에 대한 요건들과 수용

IPC/WHMA-A-620B-VN: Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây và Bộ Cáp...

IPC-A-600G-SW: Acceptability of Printed Boards

IPC-6012B-SW: Qualification and Performance Specification for Rigid Printed Boards

A-620B-PL: Wymagania i akceptacje dla montażu kabli i wiązek przewodów

A-610DJP(D)1: Acceptability of Electronic Assemblies

J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

J-STD-004A-JP: Requirements for Soldering Fluxes

J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies