IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630-CN: 电子产品整机的制造、检验和测试的可接受性标准

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC-J-STD-006C: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-2291: Design Guideline for Printed Electronics

IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-9641: High Temperature Printed Board Flatness Guideline

IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-7095C: Design and Assembly Process Implementation for BGAs

IPC-7095C: Design and Assembly Process Implementation for BGAs

IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC-2220-FAM: Design Standards for Printed Boards

IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé