16 Products

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

Member: $84.00

Nonmember: $168.00

J-STD-004B-CN: 修订本 1 助焊剂要求

Member: $65.00

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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Nonmember: $168.00

T-50H-CN: 电子电路互连与封装术语及定义

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IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Member: $47.00

Nonmember: $93.00

IPC-D-422: Design Guide for Press Fit Rigid Printed Board Back Planes

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IPC-A-311: Process Controls for Phototool Generation and Use

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IPC-6011: Generic Performance Specification for Printed Boards

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IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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Nonmember: $93.00

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices