IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
J-STD-004B-CN: 修订本 1 助焊剂要求
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
IPC-D-422: Design Guide for Press Fit Rigid Printed Board Back Planes
IPC-A-311: Process Controls for Phototool Generation and Use
IPC-6011: Generic Performance Specification for Printed Boards
IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films
IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components