IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
2 Products
IPC-D-422: Design Guide for Press Fit Rigid Printed Board Back Planes
IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
IPC-D-422: Design Guide for Press Fit Rigid Printed Board Back Planes