33 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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J-STD-001E-RO: Cerinţe pentru Ansamblurile Electrice şi Electronice Lipite

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IPC-A-610E-RO: Acceptabilitatea Ansamblurilor Electronice

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D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

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QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

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IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HM-860: Specification for Multilayer Hybrid Circuits

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC-D-354: Library Format Description for Printed Boards in Digital Form

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IPC-D-350D: Printed Board Description in Digital Form

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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C-406: Design & Application Guidelines for Surface Mount Connectors

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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IPC-4761: Design Guide for Protection of Printed Board Via Structures