IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

2221A: Generic Standard on Printed Board Design

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

D-390A: Automated Design Guidelines

D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes