9 Products

Member: $47.00

Nonmember: $93.00

D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

Member: $47.00

Nonmember: $93.00

QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

Member: $47.00

Nonmember: $93.00

IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

Member: $65.00

Nonmember: $131.00

IPC-D-350D: Printed Board Description in Digital Form

Member: $47.00

Nonmember: $93.00

IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Member: $47.00

Nonmember: $93.00

IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

Member: $47.00

Nonmember: $93.00

IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

Member: $47.00

Nonmember: $93.00

IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

Member: $65.00

Nonmember: $131.00

IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies