IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

A-600GPL(D)1: Acceptability of Printed Boards

IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

IPC-A-630-CN: 电子产品整机的制造、检验和测试的可接受性标准

J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

J-STD-004B-CN: 修订本 1 助焊剂要求

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

T-50H-CN: 电子电路互连与封装术语及定义

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

D-390A: Automated Design Guidelines

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

IPC-HM-860: Specification for Multilayer Hybrid Circuits

IPC-D-354: Library Format Description for Printed Boards in Digital Form

IPC-D-352: Electronic Design Data Description for Printed Boards in Digital Form