IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-2291: Design Guideline for Printed Electronics
IPC-7095C: Design and Assembly Process Implementation for BGAs