37 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

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IPC-A-610E-KR: 전자 어셈블리의 허용 가능성

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IPC-A-610E-FR: Acceptabilité des assemblages électroniques

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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides

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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

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A-620A-FR: Exigences et critères d’acceptation pour l’assemblage des câbles et faisceaux de câbles

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-D-352: Electronic Design Data Description for Printed Boards in Digital Form

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IPC-D-355: Printed Board Automated Assembly Description in Digital Form

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IPC-D-351: Printed Board Drawings in Digital Form

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IPC-D-325A: Documentation Requirements for Printed Boards

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C-406: Design & Application Guidelines for Surface Mount Connectors

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IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components

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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures