30 Products

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

Member: $65.00

Nonmember: $131.00

IPC-D-352: Electronic Design Data Description for Printed Boards in Digital Form

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IPC-D-351: Printed Board Drawings in Digital Form

Member: $47.00

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

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IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-9641: High Temperature Printed Board Flatness Guideline

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-2291: Design Guideline for Printed Electronics

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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components