IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

IPC-J-STD-001G-AM1: Provee requisitos para materiales de soldadura y procesos para ensambles

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-A-610DC-Telecom Addendum

IPC-A600H-Errata: IPC-A-600H Errata Information

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-A-610E-EE: Elektroonikakoostude vastavusnõuded

IPC-A-610E-TR: Elektronik Takımların Kabul Edilebilirliği

J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

IPC-A-610F-IL: קבלה של הרכבות אלקטרוניות

IPC-A-610E-IL: Acceptability of Electronic Assemblies

IPC-A-610E-KR: 전자 어셈블리의 허용 가능성

IPC-A-610E-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

IPC-A-610F-SE: Acceptanskrav för kretskort