IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
34 Products
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Member: $84.00 Nonmember: $168.00
IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
Member: $79.00 Nonmember: $155.00
IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies
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IPC-2291: Design Guideline for Printed Electronics
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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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IPC-9641: High Temperature Printed Board Flatness Guideline
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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B
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IPC-5703: Cleanliness Guidelines for Printed Board Fabricators
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IPC-7095C: Design and Assembly Process Implementation for BGAs
Member: $88.00 Nonmember: $176.00
IPC-7095C: Design and Assembly Process Implementation for BGAs
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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry
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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
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IPC-A-610DC-Telecom Addendum
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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
Member: $84.00 Nonmember: $168.00
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
Member: $84.00 Nonmember: $168.00
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components