IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-A-610DC-Telecom Addendum

IPC-A600H-Errata: IPC-A-600H Errata Information

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-A-610F-IL: קבלה של הרכבות אלקטרוניות

IPC-A-610E-IL: Acceptability of Electronic Assemblies

IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

J-STD-004B-CN: 修订本 1 助焊剂要求

IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

IPC-A-610E-CN: 电子组件的可接受性

J-STD-001E-CN: Rev E superseded by Rev F

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

T-50H-CN: 电子电路互连与封装术语及定义

IPC-1601-CN: 印制板操作和贮存指南

7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

IPC-D-352: Electronic Design Data Description for Printed Boards in Digital Form