IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B
IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1
IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-D-352: Electronic Design Data Description for Printed Boards in Digital Form
IPC-D-351: Printed Board Drawings in Digital Form
IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-1753: Laboratory Report Standard
IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-9641: High Temperature Printed Board Flatness Guideline
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-2291: Design Guideline for Printed Electronics
IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...
IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications
J-STD-030A: Selection and Application of Board Level Underfill Materials