IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
A-600GPL(D)1: Acceptability of Printed Boards
IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
J-STD-004B-CN: 修订本 1 助焊剂要求
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
D-390A: Automated Design Guidelines
IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting
IPC-HM-860: Specification for Multilayer Hybrid Circuits
IPC-D-354: Library Format Description for Printed Boards in Digital Form
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components