70 Products

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-7527: 焊膏印刷要求 - Chinese

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IPC-2220-FAM: Design Standards for Printed Boards

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IPC-7095C-CN: BGA设计与组装工艺的实施

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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IPC-A-630-CN: 电子产品整机的制造、检验和测试的可接受性标准

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4562A-CN: 印制板用金属箔

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J-STD-005A-CN: 焊膏要求

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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IPC-7711/21B-CN: 电子组件的返工、修改和维修

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IPC-9252A-CN: 未组装印制板电气测试要求

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits