29 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

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IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

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IPC-A-610E-CN: 电子组件的可接受性

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J-STD-001E-CN: Rev E superseded by Rev F

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IPC-1601-CN: 印制板操作和贮存指南

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

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IPC-HM-860: Specification for Multilayer Hybrid Circuits

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IPC-D-354: Library Format Description for Printed Boards in Digital Form

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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1756: Manufacturing Process Data Management

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IPC-A-610E: Acceptability of Electronic Assemblies

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials