111 Products

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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Nonmember: $93.00

IPC-9641: High Temperature Printed Board Flatness Guideline

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-2291: Design Guideline for Printed Electronics

Member: $84.00

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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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Nonmember: $168.00

J-STD-030A: Selection and Application of Board Level Underfill Materials

Member: $0.00

Nonmember: $0.00

1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

Member: $28.00

Nonmember: $28.00

J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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Nonmember: $28.00

IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

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Nonmember: $168.00

IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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Nonmember: $168.00

IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries