84 Products

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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J-STD-001F-KR: 솔더링된 전기 및 전자 어셈블리에 대한 요건들

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J-STD-001F-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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J-STD-001F-JP: はんだ付される電気及び電子組立品に関する要件事項

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IPC-A-610F-KR: 전자 어셈블리에 대한 허용 가능성

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J-STD-001F-RU: Требования к электрическим и электронным сборкам, изготавливаемым с помощью пайки

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IPC-A-610F-RU: Критерии приемки электронных сборок

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IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

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IPC-A-610F-TH: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

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IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

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IPC-A-610F-RO: Acceptabilitatea Ansamblurilor Electronice

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IPC-A-610F-PL: Dopuszczalność Zespołów Elektronicznych

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IPC-A-610F-DK: Godkendelseskrav for elektronikprodukter