9 Products

Member: $0.00

Nonmember: $0.00

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

Member: $47.00

Nonmember: $93.00

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

Member: $84.00

Nonmember: $168.00

IPC-HM-860: Specification for Multilayer Hybrid Circuits

Member: $84.00

Nonmember: $168.00

IPC-HDBK-005: Guide to Solder Paste Assessment

Member: $65.00

Nonmember: $131.00

IPC-D-354: Library Format Description for Printed Boards in Digital Form

Member: $47.00

Nonmember: $93.00

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

Member: $47.00

Nonmember: $93.00

IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

Member: $65.00

Nonmember: $131.00

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Member: $84.00

Nonmember: $168.00

IPC-4761: Design Guide for Protection of Printed Board Via Structures