IPC-9850A: Surface Mount Placement Equipment Characterization

IPC-6018B-CN: 高频（微波）印制板的鉴定及性能规范

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-7525B-CN: 模板设计指导

IPC-7525B-DE: Designrichtlinie für Druckschablonen

IPC-7525B: Stencil Design Guidelines

IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-T-50J: SUPERSEDED BY T-50K

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

IPC-CH-65B-CN: 印制板及组件清洗指南

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components

J-STD-004B-CN: 修订本 1 助焊剂要求

IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

T-50H-CN: 电子电路互连与封装术语及定义

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610DC-Telecom Addendum

IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies