IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

A-600GPL(D)1: Acceptability of Printed Boards

IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

IPC-CH-65B-CN: 印制板及组件清洗指南

IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

IPC-7525B-CN: 模板设计指导

J-STD-004B-CN: 修订本 1 助焊剂要求

IPC-6018B-CN: 高频（微波）印制板的鉴定及性能规范

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

T-50H-CN: 电子电路互连与封装术语及定义

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

IPC-7525B-DE: Designrichtlinie für Druckschablonen

IPC-HM-860: Specification for Multilayer Hybrid Circuits

IPC-D-354: Library Format Description for Printed Boards in Digital Form

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products