IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-HM-860: Specification for Multilayer Hybrid Circuits
IPC-D-354: Library Format Description for Printed Boards in Digital Form
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components