IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610DC-Telecom Addendum

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-OI-645: Standard for Visual Optical Inspection Aids

IPC-S-816: SMT Process Guideline Checklist

D-310C: Guidelines for Phototool Generation and Measurement Techniques

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

D-390A: Automated Design Guidelines