IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

IPC-J-STD-001G-AM1: Provee requisitos para materiales de soldadura y procesos para ensambles

IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-A-610DC-Telecom Addendum

IPC-A600H-Errata: IPC-A-600H Errata Information

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

IPC-A-610E-EE: Elektroonikakoostude vastavusnõuded

IPC-A-610E-TR: Elektronik Takımların Kabul Edilebilirliği

IPC-7711/21B-TR: Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım

J-STD-001E-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

IPC-A-610F-IL: קבלה של הרכבות אלקטרוניות

IPC-A-610E-IL: Acceptability of Electronic Assemblies

IPC-A-610E-KR: 전자 어셈블리의 허용 가능성

J-STD-001F-KR: 솔더링된 전기 및 전자 어셈블리에 대한 요건들