IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

D-390A: Automated Design Guidelines

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-HDBK-005: Guide to Solder Paste Assessment

IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC-A-311: Process Controls for Phototool Generation and Use

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

IPC-6011: Generic Performance Specification for Printed Boards

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IPC-4761: Design Guide for Protection of Printed Board Via Structures

IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

IPC-9641: High Temperature Printed Board Flatness Guideline

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC-2291: Design Guideline for Printed Electronics

IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits