IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
3 Products
IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting
D-390A: Automated Design Guidelines
IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting
D-390A: Automated Design Guidelines