96 Products

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IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

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IPC-1601A: Guía para el manejo y almacenamiento de tarjetas impresas

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IPC-1601A: Guía para el manejo y almacenamiento de tarjetas impresas

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

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J-STD-001F-JP: はんだ付される電気及び電子組立品に関する要件事項

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A-610DJP(D)1: Acceptability of Electronic Assemblies

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J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-600G-JP/EK: Acceptability of Printed Boards

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-A-600J-SP: Aceptabilidad de Tableros Impresos

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IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

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D-390A: Automated Design Guidelines

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IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials