62 Products

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-2220-FAM: Design Standards for Printed Boards

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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7351A-DE: SUPERSEDED BY 7351B-DE

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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IPC-2221B-DE: Basisrichtlinie für das Design von Leiterplatten

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IPC/WHMA-A-620B-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

Member: $66.00

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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D-310C: Guidelines for Phototool Generation and Measurement Techniques

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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

Member: $66.00

Nonmember: $131.00

C-406: Design & Application Guidelines for Surface Mount Connectors

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards