35 Products

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC-2220-FAM: Design Standards for Printed Boards

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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D-310C: Guidelines for Phototool Generation and Measurement Techniques

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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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C-406: Design & Application Guidelines for Surface Mount Connectors

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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TM-650-MDP: Method Development Packet

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1758: Declaration Requirements for Shipping, Pack and Packing Materials

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-005A: Requirements for Soldering Pastes

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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline

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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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7095B(D)1: Design and Assembly Process Implementation for BGAs