35 Products

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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D-356B: Bare Substrate Electrical Test Data Format

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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C-406: Design & Application Guidelines for Surface Mount Connectors

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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IPC-4761: Design Guide for Protection of Printed Board Via Structures

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IPC-2252: Design Guide for RF/Microwave Circuit Boards

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

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IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-9641: High Temperature Printed Board Flatness Guideline

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-2291: Design Guideline for Printed Electronics