IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

IPC-CM-770E: Component Mounting Guidelines for Printed Boards

IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

IPC-1720A: Assembly Qualification Profile

IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

IPC-9641: High Temperature Printed Board Flatness Guideline

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC-2291: Design Guideline for Printed Electronics

IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

IPC-7095C: Design and Assembly Process Implementation for BGAs