7095B(D)1: Design and Assembly Process Implementation for BGAs
IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink
IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
REACHGUIDE08: REACH & The Electronics Industry Supply Chain: The Basics, the Impact and How to...
IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-2291: Design Guideline for Printed Electronics
IPC-7095C: Design and Assembly Process Implementation for BGAs
IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings