IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-2291: Design Guideline for Printed Electronics

IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-9641: High Temperature Printed Board Flatness Guideline

IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

IPC-7095C: Design and Assembly Process Implementation for BGAs

IPC-7095C: Design and Assembly Process Implementation for BGAs

IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards