50 Products

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-7095C-CN: BGA设计与组装工艺的实施

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IPC-A-630-CN: 电子产品整机的制造、检验和测试的可接受性标准

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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

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IPC-A-610E-CN: 电子组件的可接受性

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J-STD-001E-CN: Rev E superseded by Rev F

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IPC-1601-CN: 印制板操作和贮存指南

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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1756: Manufacturing Process Data Management

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IPC-A-610E: Acceptability of Electronic Assemblies