33 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

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IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

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IPC-D-350D: Printed Board Description in Digital Form

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IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

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C-406: Design & Application Guidelines for Surface Mount Connectors

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-A-311: Process Controls for Phototool Generation and Use

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

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IPC-6011: Generic Performance Specification for Printed Boards

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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

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IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

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IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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1756: Manufacturing Process Data Management