24 Products

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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A-610DHU: Acceptability of Electronic Assemblies

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IPC-9691A-CN: IPC-TM-650 测试方法2.6.25 耐导电阳极丝(CAF)测试(电化学迁移测试)用户指南

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J-STD-004B-CN: 修订本 1 助焊剂要求

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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IPC-WHMA-A-620A-CN: Rev A superseded by Rev B

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2221A-CH: Generic Standard on Printed Board Design

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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C-406: Design & Application Guidelines for Surface Mount Connectors

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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IPC-7526: Stencil and Misprinted Board Cleaning Handbook

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-9201A: Surface Insulation Resistance Handbook

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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IPC-5702: Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

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IPC-7711/21B: Rework, Modification and Repair of Electronic Assemblies

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IPC-SM-840D: Qualification and Performance
Specification of Permanent Solder Mask