87 Products

Member: $97.00

Nonmember: $193.00

IPC-2223A-DE: Sectional Design Standard for Flexible Printed Boards

Member: $69.00

Nonmember: $137.00

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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IPC-2221B-DE: Basisrichtlinie für das Design von Leiterplatten

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IPC/WHMA-A-620B-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

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C-406: Design & Application Guidelines for Surface Mount Connectors

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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IPC-7526: Stencil and Misprinted Board Cleaning Handbook

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

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IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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IPC/WHMA-A-620B-CN: 线缆及线束组件的要求与验收

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TM-650-MDP: Method Development Packet

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1758: Declaration Requirements for Shipping, Pack and Packing Materials

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-005A: Requirements for Soldering Pastes

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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-9201A: Surface Insulation Resistance Handbook

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability