25 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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D-356B: Bare Substrate Electrical Test Data Format

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C-406: Design & Application Guidelines for Surface Mount Connectors

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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IPC-2252: Design Guide for RF/Microwave Circuit Boards

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IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

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2221A: Generic Standard on Printed Board Design

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1756: Manufacturing Process Data Management

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IPC-A-610E: Acceptability of Electronic Assemblies

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-9151D: Process Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database