IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...
69 Products
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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B
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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies
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D-310C: Guidelines for Phototool Generation and Measurement Techniques
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IPC-D-355: Printed Board Automated Assembly Description in Digital Form
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IPC-D-325A: Documentation Requirements for Printed Boards
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IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download
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IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components
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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures
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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat
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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards
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IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
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IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
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IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
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IPC-9641: High Temperature Printed Board Flatness Guideline
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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
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IPC-2291: Design Guideline for Printed Electronics
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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
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IPC-5703: Cleanliness Guidelines for Printed Board Fabricators
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IPC-7095C: Design and Assembly Process Implementation for BGAs
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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry