IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

9702-CN: 板极互连的单向弯曲特性描述

J-STD-004B-CN: 修订本 1 助焊剂要求

IPC-1720A-CN: 组装资格认证纲要

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

T-50H-CN: 电子电路互连与封装术语及定义

IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

D-310C: Guidelines for Phototool Generation and Measurement Techniques

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-CM-770E: Component Mounting Guidelines for Printed Boards

IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

2221A: Generic Standard on Printed Board Design

IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

IPC-1720A: Assembly Qualification Profile

IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability