IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

J-STD-001F-KR: 솔더링된 전기 및 전자 어셈블리에 대한 요건들

IPC-A-610F-KR: 전자 어셈블리에 대한 허용 가능성

IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

IPC-A-610F-RO: Acceptabilitatea Ansamblurilor Electronice

A-600GPL(D)1: Acceptability of Printed Boards

J-STD-001F-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

IPC-A-610F-PL: Dopuszczalność Zespołów Elektronicznych

IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

J-STD-001F-JP: はんだ付される電気及び電子組立品に関する要件事項

J-STD-001F-DK: Krav til loddede elektriske og elektroniske produkter

IPC-A-610F-DK: Godkendelseskrav for elektronikprodukter

9702-CN: 板极互连的单向弯曲特性描述

J-STD-004B-CN: 修订本 1 助焊剂要求

J-STD-003C-CN-WAM1: 印制板可焊性测试