39 Products

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J-STD-001F-JP: はんだ付される電気及び電子組立品に関する要件事項

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J-STD-001F-IT: Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici

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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

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J-STD-001F-DK: Krav til loddede elektriske og elektroniske produkter

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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D-310C: Guidelines for Phototool Generation and Measurement Techniques